Infineon Technologies AG announced that it has signed a letter of intent (LOI) for framework purchase agreement amounting US$68 million with Huawei Technologies of China.

This deal, as an important part of the recent European procurement tour of the Chinese business delegation, is intended to supply end-to-end chip solutions to Huawei's wireline and wireless communication systems.

Infineon will provide semiconductor solutions for Huawei in the area of central office solutions (CO), customer premise equipment (CPE) and mobile phone platforms.

These semiconductor solutions purchased from Infineon will enable Huawei to deliver advanced and sophisticated systems to the telecom markets. Shipment of the first products has already started.